The Trinity Auto Mold & Trim Form System is designed to deliver precise and efficient molding and trimming processes in manufacturing.
Our auto molding system is designed with flexibility at its core, offering a range of customized functions to meet diverse production requirements.
Suitable for products when the runner on the upper and needs to be turned over before degate, such as TO252, IPM, etc. No effect on mechanical time.
Prevent chip being tilted in molding, and solve a series of problems such as wire arc, wire sweep and so on. Suitable for IPM, DIP, IGBT series package.252, IPM, etc. No effect on mechanical time.
Using automatic film assist technology to achieve chip exposed type packaging which is a representative of the sensor and power device molding when heat sink required exposed.
Installed in our 180T Auto Molding System platform and suitable for narrow products, such as power devices and tantalum capacitors.
For trimming and forming process of TO products. The CCD, remote operation and CIM management systems can be configured.
For trimming and forming process of TO products. The CCD, remote operation and CIM management systems can be configured.
For trimming and forming process of SOP, TSSOP, ESOP, MSOP etc. Punching Speed: 120SPM. Singulation Speed: 65SPM. Function: Auto lead trimming, forming, separation, loading, collecting and changing tube.
For multi-row SOT or SOD series package type. Punching Speed: 180SPM. The system adopts high-speed punching mechanism.
