Wafer optical inspection equipment is used for wafer appearance inspection before or after cutting; it adopts multiple objective microscope modules, high-speed camera with fast flying shot to collect images, and supports a variety of intelligent algorithms; it supports black and white color dual vision configuration, which can realize black and white/color, high and low magnification switching inspection; the equipment supports SECS communication to realize equipment monitoring and data upload. Achievable the surface inspection in both bright and dark fields by dual illumination methods. Support standard and customized mapping formats, supports online and offline high magnification recheck functions.