Taping Related Equipment Series | Advance Precision Automation Industry Sdn Bhd

Taping Related Equipment Series

Provides efficient solutions for modern lamination processes with high precision and consistent quality. optimal speed and ease of operation

Auto LC Tape Laminator MF-ALC300

Applications

This Equipment is fully automatic application of LC tape lamination for WLP product.

Technology

Apply 8–12 inch, thickness 400–800 µm product
UPH 30 wafer / Hour
Application Tape: LC Tape, Pre-cut
Pre-cut Blade: Pinnacle Die
Tape accuracy: ± 0.15 mm
Support SECS/GEM

Auto UV MF-AUV300

Applications

This Equipment is fully automatic application of irradiation UV light to UV tape for easy removement.

Technology

Apply 8–12 inch
UPH 100 wafer / Hour
UV Specification: Wavelength: 365 nm
Type: LED
Life time: >20,000 hours
Support SECS/GEM

Auto Wafer De-Mounter MF-ADM300

Applications

This Auto De-Mount system is a fully automatic machine for removing dicing tape attached to 8 & 12 ring frames.

Technology

Apply 8–12 inch, thickness 400–800 µm product
UPH 40–45 wafer / Hour
UV Specification: Wavelength: 365 nm
Type: LED
Life time: >20,000 hours
Support SECS/GEM

Auto Lead Frame Taping MF-TM100P

Applications

This Auto De-Mount system is a fully automatic machine for removing dicing tape attached to 8 & 12 ring frames.

Technology

Application lead frame Size:
Width: 15–100 mm
Length: 125–300 mm
UPH 100 unit / hour
Conversion time < 10 mins
Support SECS/GEM

PKG Boat Turn Over System MF-F310

Applications

This equipment is used for PKG Boat replacement, PKG in the Boat automatically turn over.

Technology

Boat length 180–310 mm, width 100–160 mm
Different Boat sizes can be easily and quickly switched
The Boat is monitored in real time within the orbit
PKG all CCD detection, identification of PKG type category, prevent MIX
Support SECS/GEM